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Molded Interconnect Device (MID) Market Revenue Outlook: What CAGR Lies Ahead Through 2030?
The molded interconnect device (mid) market size has observed swift expansion in recent years. This market is projected to expand from $2 billion in 2025 to $2.31 billion in 2026, achieving a compound annual growth rate (CAGR) of 15.5%. This historical expansion was influenced by the rise of miniaturized electronics, early integration into automotive and consumer devices, the established reliance on traditional wiring and connectors, the broadening of industrial sensor packaging applications, and the rising adoption of compact electromechanical components.
The molded interconnect device (mid) market size is projected to experience substantial expansion in the coming years. It is forecast to reach $4.08 billion in 2030, exhibiting a compound annual growth rate (CAGR) of 15.3%. This increase during the forecast period can be attributed to several factors, including the rising demand for high-density interconnect solutions, the growth within wearable and medical device electronics, the expansion of antenna and RF module integration, increasing adoption in advanced automotive systems, and the development of low-cost precision molded circuitry. Significant trends for the forecast period include the uptake of intelligent 3D electromechanical integration, advancements in automated LDS and two-shot molding processes, the creation of smart connected MID components, the spread of digitally optimized manufacturing workflows, and the integration of sustainable lightweight electronic structures.
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Molded Interconnect Device (MID) Market Growth Drivers: What’s Behind The Acceleration?
The expanding demand for IoT devices is projected to boost the molded interconnect devices market in the foreseeable future. IoT devices are defined as billions of physical objects linked to the internet, all of which collect and exchange data with other online systems. The need for IoT devices is growing due to the increasing requirement for connectivity and automation in residential and industrial settings. Molded interconnect devices (MID) are employed in IoT devices to integrate electronic circuits directly onto 3D plastic structures, fostering compact and efficient designs. For example, in September 2024, IoT Analytics, a Germany-based provider of strategic business intelligence for IoT, stated that the global total of connected IoT devices reached 16.6 billion at the end of 2023, showing a 15% year-on-year increase from 2022. Thus, the rising demand for IoT devices will propel the molded interconnect devices market.
Molded Interconnect Device (MID) Market Segment Performance And Emerging Opportunities
The molded interconnect device (mid) market covered in this report is segmented –
1) By Product: Antenna And Connectivity Modules, Connectors And Switches, Sensors, Lighting
2) By Process: Laser Direct Structuring (LDS), Two-Shot Molding, Other Processes
3) By Application: Automotive, Consumer Products, Healthcare, Industrial, Military And Aerospace, Telecommunication And Computing
Subsegments:
1) By Antenna And Connectivity Modules: Integrated Antennas, RF Modules
2) By Connectors And Switches: Electrical Connectors, Mechanical Switches
3) By Sensors: Temperature Sensors, Pressure Sensors, Proximity Sensors
4) By Lighting: LED Lighting Modules, Decorative Lighting Solutions
Molded Interconnect Device (MID) Market Trends: What’s Defining The Industry’s Next Phase?
Leading firms within the molded interconnect device (MID) market are concentrating on novel offerings, including light antennas, to boost their earnings. The light antenna represents a groundbreaking wireless communication antenna, measuring less than a US dime, designed to facilitate broad adoption of LiFi technology in smartphones and various connected devices. An example occurred in February 2023, when pureLiFi Limited, a Scottish firm specializing in Li-Fi (Light Fidelity) technology, unveiled a LiFi Light Antenna. This light antenna serves to activate LiFi capabilities in connected devices and has been engineered for integration much like a standard RF antenna. By harnessing the light spectrum, LiFi outperforms conventional technologies like Wi-Fi and 5G concerning speed, dependability, and security. Manufacturers of smartphones and other connected devices will be able to deploy LiFi widely, thanks to Light Antenna ONE’s optimization for performance, compact size, cost-effectiveness, and production requirements.
Molded Interconnect Device (MID) Market Key Players: Which Companies Lead Industry Competition?
Major companies operating in the molded interconnect device (mid) market are Molex LLC, TE Connectivity Ltd., Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe, Arlington Plating Company, MID Solutions LLC, MacDermid Inc., JOHNAN Corporation, TactoTek Oy, Axon’ Cable S.A.S, S2P Solutions, Suzhou Cicor Technology Co. Ltd, Chogori Technology Co. Ltd., Mitsubishi Engineering-Plastics Corporation, Galtronics Corporation Ltd., RTP Company, BASF SE, EMS-Chemie Holding AG, Ensinger GmbH, Zeon Corporation, SelectConnect Technologies, Multiple Dimensions AG, Cicor Group, Tesa SE, Yomura Technologies Inc., T-Ink Inc., ODU GmbH & Co. KG
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Molded Interconnect Device (MID) Market Top Region: Where Does Most Revenue Come From?
Asia-Pacific was the largest region in the molded interconnect device (MID) market share in 2025. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the molded interconnect device (mid) market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
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Wasay has over a decade of experience in market research, data modelling, and analytics, with prior experience at GlobalData and Decision Tree Consulting Services. At The Business Research Company , he leads research operations across syndicated studies, customized consulting engagements, and the Global Market Model platform. His professional experience includes supporting organizations such as Boston Consulting Group, KPMG, and Ernst & Young. Wasay holds a degree in Electronics and Communications Engineering, postgraduate management qualifications from International Management Institute Belgium and Indian School of Business and Entrepreneurship, and completed the Integrated Program in Business Analytics from Indian Institute of Management Indore.
